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Introducing the ER8 Series, 0.8mm Pitch, High-Speed, Board-to-Board Connector from HIROSE
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Recognised as the UK’s number one for reliability, flexibility and customer service.
Overview
Formed as a joint venture between Qualcomm and TDK in 2016, Qualcomm RF360 products include advanced SAW devices, RF front-end (RFFE) modules and RF filters.
