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Low cost thermal management material for High Brightness LED applications from Bergquist
02 April 2007 |
| 3.5 times the thermal performance of epoxy glass-on-aluminium and almost every PCB fabricator can process it. Bond-Ply(tm) TCP-1000 Bergquist’s latest dielectric satisfies the extreme thermal demands of applications using high brightness LEDs (HB-LEDs). |
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Hi-Flow® 225UF phase change thermal interface material provides superior performance and easy handling characteristics
04 August 2003 |
| Hi-Flow 225UF utilizes a non-tackified formula of the field-proven Hi-Flow 225U compound to eliminate adhesive bleed out while providing low thermal resistance. |
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Bond-Ply® 400 tape delivers an enhanced thermal performance as well as easy handling characteristics
28 July 2003 |
| Bond-Ply® 400 provides superior wet-out in an un-reinforced, thermally-conductive, pressure sensitive adhesive tape. |
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Hi-Flow® 300 is one of the highest performing insulated phase change thermal interface materials on the market
15 May 2003 |
| Hi-Flow® 300 provides superior thermal performance as well as easy handling characteristics. |
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Thermal phase change material from Bergquist that applies more easily than a postage stamp.
12 November 2002 |
| Hi-Flow’s industry-leading thermal performance provides a low thermal resistance path between hot components and heat sinks, ensuring power devices, chip sets, CPU’s or sensitive electronics reliability. |
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