Supplier sections
3peak Incorporated
Abracon LLC
Adam Tech
Advantech
Airpax
Alliance Memory
Altran Magnetics
American Technical Ceramics
Antenova
Arcol
Arcolectric
Avalue
BEI Sensors
Bel components
BeRex
Bergquist
Binder
Bivar
Bloomice
Bolb Inc
Bourns
Boyd
Bulgin
Bussmann
C&K
Calinar
Cambion
CamdenBoss
Carclo
CEL
Ceramate
Cliff Electronic Components
Conquer
Cornell Dubilier
Cosmic
Co-Tron
Cree
Cre-Sound
Crydom
CTC
CTi
Cynergy3
Deltron
Digi International
Diptronics
EAO
Eaton Bussmann/Coiltronics
ECE
Ecliptek
Efficient Power Conversion
Efore
Ekinglux
Elettronica Rossoni
EPOC
ESI
Eurohm
Fischer
Fox Electronics
Gigavac
Hahn
Haimooo
Hammond Manufacturing
Harting
Harwin
Herald
Hirose
Hirschmann
Honeywell
Hongfa
Hope RF
Hudson
Ilsi
Inalways
Invac
ISOCOM Components
Ixys
JDI Europe
JNC
Kang yang
Keystone
Khatod
Kingtek
KOA
KYOCERA AVX
Laird Technologies
LEDIL
Lifud Technology
LITE-ON Optoelectronics
Littelfuse
Lorlin Electronics
Lumberg
Lumileds
Magnetix
Magnetone
Marl
Mascot
Mitsubishi
Mmd
M-Pro
Mueller
Murata
MurataPS
Neutrik
Nichicon
Nover
Ohmite
OKO
Omron
Panasonic
PANJIT
Phoenix Contact
Pickering
Piher
Polymer Optics
Quay RF
Renata
RF360
ROHM
Roxburgh
Same sky
Samsung
Sanyo Denki
Schurter
Sensata
Sensirion
Shindengen
SIMCom
Solomon Systech
STMicroelectronics
Studiomate
Taicom
Taiwan Semiconductor
Taiway
Taoglas
TDK
Tdk Invensense
Telit Cinterion
Tianbo
Titan-Opto
Tokyo Parts
Toshiba
Varta
Vero Technologies
Vigortronix
Walsin
Warth
WIMA
Winbond
Winslow Adaptics
Introducing the KOA RH73H Series of thin film precision resistors engineered for performance, built for reliability. Samples available from Anglia
Anglia delivers by
Recognised as the UK’s number one for reliability, flexibility and customer service.
Overview
Boyd’s thermal solutions cover a wide range of applications and devices and employ a variety of unique technologies from Off-the-shelf cooling solutions for standard electrical packages, such as TO-220, TO-3, DIP and many others to complete cooling solutions for popular microprocessors, including interface material and attachment methods.
