Supplier sections
Distributed Air Gap Ferrite Cores from TDK increase power density and reduce size, samples available from Anglia.
Overview
Boyd’s thermal solutions cover a wide range of applications and devices and employ a variety of unique technologies from Off-the-shelf cooling solutions for standard electrical packages, such as TO-220, TO-3, DIP and many others to complete cooling solutions for popular microprocessors, including interface material and attachment methods.















































































































































