The first LGA M2M modules from Cinterion are now in production

The EDGE module of Cinterion's previously announced new LGA solderable platform has recently achieved the SoP including all necessary approvals for a worldwide coverage. The EES3 is on the EDGE of Cinterion's Evolution Platform based on LGA (Land Grid Array) mounting technology for reliable and automated manufacturing. It addresses all applications requiring high-speed data transfers in GSM networks together with demand for flexibility and scalability.

The EES3 Wireless Module is one of the smallest EDGE modules in the world (Enhanced Data Rates for GSM Evolution). The EES3 features EDGE Class 12 (the fastest transmission standard in GSM with 236.8 kbps in uplink and downlink), an integrated TCP/IP stack over AT, serial and USB ports, and a RIL driver for Microsoft® Windows™ Mobile 6.1 based devices.

Order Details:
L30960-N1500-A100 EES3
L30960-N1505-A100 EES3 Customer IMEI
L30960-N1501-A100 EES3 Evaluation Module
L30960-N1502-A100 Daisy Chain

Click here to download a datasheet for the LGA solderable platform

Further information:

• An LGA White Paper is in preparation. It will describe from a technological point of view the differences respective advantages and disadvantages of three known Surface Mounting Technologies (SMT): BGA, Castellation and LGA. please contact our sales desk for information

For more information, or details on the full range of Cinterion products available from Anglia, please call +44 (0)1945 474747 or email info@anglia.com

Or click on this link to view the Anglia M2M website www.anglia-m2m.com where you can view information on this and other M2M communication solutions.

Alternatively, click on this link to go to the main Cinterion section where you can view other news articles and product data.

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