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Microchip expands family of low-cost, small-package 32-bit PIC32 microcontrollers
The new low pin-count microcontrollers provide 61 DMIPS of performance in packages as small as 5 x 5 mm, for space-constrained and cost-sensitive designs, and are the first PIC32 MCUs to feature dedicated audio and capacitive-sensing peripherals.

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Bergquist extends phase-change thermal materials range with high temperature, high conductivity Hi Flow 650P variant


Bergquist extends phase-change thermal materials range with high temperature, high conductivity Hi Flow 650P variant
14 June 2012
With its 150°C temperature rating, Hi-Flow 650P is ideally suited for use in harsh conditions and features high thermal conductivity, electrical isolation, polyimide reinforcement and natural tack to aid assembly.
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Super soft thermal material from Bergquist reduces strain on fragile components


Super soft thermal material from Bergquist reduces strain on fragile components
16 April 2009
Gap Pad 1500S30 is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fibreglass reinforced for improved puncture resistance and handling characteristics.
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